$ 1,428.00
Transmission Distance: Up to 500m over OS2 SMF
Connector Type: Dual MPO-12
Wavelength: 1310nm
Power Efficiency: <18W, reducing TCO and improving energy savings
Chip Technology: 7nm DSP with advanced silicon photonics (SiPh) platform
Compliance: OSFP MSA, IEEE 802.3, and CMIS management compatibility
$ 1,668.00
Transmission Distance: Up to 2km over OS2 SMF
Connector Type: Dual Duplex LC
Wavelength: 1310nm
Power Consumption: ≤16W, optimized for energy efficiency
Chip Technology: 7nm DSP with SiPh integration and 3D packaging
Compliance: OSFP MSA, IEEE 802.3, CMIS-compatible
$ 750.00
Form Factor : OSFP, MSA-compliant, hot-pluggable
Data Throughput : 8 × 106.25 Gbps (PAM4) = total 850 Gbps
Fiber Interface : 850 nm VCSEL over OM4 multimode fiber, up to 100 m (60 m on OM3)
Connecto r: MPO-16 APC for streamlined cabling and high-density
Power Consumption : Under 13.5 W for energy-efficient operation
Voltage : Standard 3.3 V supply
Diagnostics : Integrated digital monitoring (DDM/DOM)
Compliance : Meets OSFP MSA, IEEE 802.3db, and RoHS standards
$ 689.00
Form Factor: OSFP, hot-swappable, MSA-compliant
Data Rate: 8 × 106.25 Gbps (aggregate 850 Gbps)
Optical Technology: 850 nm VCSEL over OM4 multimode fiber
Reach: Up to 50 m for short-distance rack-to-rack connections
Connector: Dual MPO-12 for simplified, high-density cabling
Power Efficiency: <15 W (<13.5 W in optimized deployments)
Diagnostics: Digital monitoring (DDM/DOM) for real-time performance tracking
Compliance: OSFP MSA, CMIS, IEEE 802.3db, RoHS 2.0
$ 750.00
Bandwidth: 800G Ethernet (8×53.125Gb/s PAM4)
Transmission Distance: Up to 100m over OM4 multimode fiber (MMF)
Connector Type: MPO-16 APC
Wavelength: 850nm (VCSEL-based)
Power Consumption: ≤13.5W, designed for energy-efficient operations
Technology: VCSEL + PIN photodetector array
Hot-Pluggable: Easy installation and maintenance
Compliance: OSFP MSA, IEEE 802.3, CMIS compatible
$ 2,016.00
Transmission Distance : Up to 10km over OS2 SMF
Connector Type : Dual Duplex LC
Wavelength : 1310nm
Power Efficiency : ≤16W, optimized for long-haul operations
Chipset : Advanced 7nm DSP with SiPh & 3D packaging integration
Compliance : OSFP MSA, IEEE 802.3, CMIS-compatible
Diagnostics : Digital monitoring for real-time performance insights