COM Express Type 7 Basic Size Module with Marvell® OCTEON® 10 CN102 Processor
Price: Contact for Quote VAT excl.
- Up to IMarvell® OCTEON® 10 CN102 with 8 Arm® Neoverse™ N2 Cores
- 4 x 10 Gigabit Ethernet KR Interface, 1 x Gigabit Ethernet
- 5 x PCI Express lanes (GEN 3.0)
- Supporting up to 48 GB DDR5 5600MT/s Memory
- Up to 16 MB cache
- Max. Processor TDP 33W (fanless)
- Standard operating temperature 0~60 °C
33 W
Max. Processor TDP
48 GB
DDR5 5600MT/s Memory with ECC
1.5
SPECint / Watt Efficiency
5 nm
Process Node
5
PCIe Express Lanes
The CME102 is a standard COM Express Basic module
built on TSMC's 5 nm process and powered by the Marvell OCTEON 10 CN102 processor. It combines eight Arm Neoverse N2 cores with dedicated hardware acceleration engines in a single SoC, functioning as both the control-plane CPU and the data processing unit for white-box switches, routers, gateways, firewalls, SD-WAN appliances and 5G small cells.
Arm-based compute with a separated control and data plane
The architecture separates control-plane software from data-plane forwarding. Eight Arm Neoverse N2 cores run Linux, network operating systems, storage services and routing applications, each with 1 MB of L2 cache and access to up to 16 MB of shared last-level cache. Packet processing and line-rate encryption are handled by dedicated hardware engines rather than the general-purpose cores, so control-plane workloads do not compete with forwarding for CPU cycles. The processor delivers a SPECint rate of 36.5 within this configuration.
Hardware VPP and inline IPsec for wire-speed forwarding
On-chip 4×10GBASE-KR connectivity is paired with a hardware VPP packet engine and inline IPsec/crypto acceleration, so routing, firewall and BNG functions run at wire speed with minimal CPU involvement. This offload model is what distinguishes the CN102 from general-purpose x86 alternatives, where the same functions typically consume general-purpose cores through software stacks such as AES-NI or Intel QAT.
Memory, storage and I/O for embedded carrier boards
The module supports up to 48 GB of DDR5 ECC memory at speeds up to 5600 MT/s in a single 262-pin SODIMM socket. Local boot storage is provided by 64 GB of eMMC (HS200/400) with SPI NOR flash for boot code. I/O includes 4×10GBASE-KR plus 1×GbE Ethernet, up to 5 PCIe Gen3 lanes, 4×USB 3.0/2.0, 1×SATA, 2×UART and 2×I²C, along with 4 GPI/4 GPO for carrier-board integration and a watchdog timer for diagnostics.
Fanless operation within a 33 W envelope
The CN102's 5 nm process allows the module to deliver eight-core throughput within a 33 W TDP, low enough for fanless operation across a 0–60°C operating range. This removes the active cooling that Intel Xeon D-1700-class modules typically require at a comparable core count, reducing chassis complexity and BOM cost in space- and power-constrained edge designs.
Standard form factor for long deployment life
The CME102 uses a 440-pin board-to-board connector (0.5 mm pitch, TE) with a matched heatsink option, keeping it interchangeable with other COM Express Basic Type 7 modules built to the same pinout. Combined with the 0–60°C operating range, this gives designers a stable upgrade path for carrier boards deployed across switches, storage systems, NGFWs, SD-WAN appliances and industrial edge devices without requiring a board redesign.
| Form Factor & Processor System | |||
|---|---|---|---|
| Form Factor | COM Express Basic Module | Processor Module | Marvell® OCTEON® 10 CN102 |
| Pin-out Type | COM Express R3.0 Type 7 compatible | CPU Cores | Architecture | 8 | Arm® Neoverse™ N2 |
| Base Frequency | 2.5GHz | Last Level Cache (LLC) | 16MB |
| Energy Efficiency | 1.5 SPECint / watt | SPECrate2017_int | 36.5 |
| Max. Processor TDP | 33 W (Fanless-Capable) | ||
| Memory & Expansion | |||
| Technolgy | DDR5 | Max. Frequency | 5600 MT/s |
| ECC Support | Built-in ECC (Error-Correcting Code) | Max. Capacity | Up to 48GB |
| Form Factor | 1 x 262-pin SODIMM | PCIe Expansion | Up to 5 x PCIe Gen3 (Supports Lane Bifurcation) |
| Ethernet & Hardware Accelerators | |||
| 10GB Ethernet | 4 × 10G-KR | Gigabit | 1 × Gigabit Ethernet Port (10M/100M/1000M) |
| Packet Processing | Native Hardware VPP (Vector Packet Processing) engine | Security Acceleration | Inline IPsec / High-Performance Crypto engine |
| I/O Interfaces & System Controls | |||
| USB | 4x USB 3.0 / USB 2.0 | Storage Interface | 1 x SATA |
| Serial Port | 2 x UART | Bus Interface | 2 x I²C |
| GPIO | 4 x GPI, 4 x GPO | Diagnostics | WDT, SPI BIOS |
| Power & Environment & Mechanical | |||
| Power Input | VCC_12V (11.4V–12.6V), 4A | Operating Temperature | Standard: 0 ~ 60 °C (32 ~ 140 °F) |
| Dimensions | 125 mm × 95 mm (4.92" × 3.74") | ||
Loading…
Loading…
